Nitride bonded silicon carbide materials consist of SiC grains reaction bonded by a silicon nitride (Si3N4) based matrix. The features of this kind of material include an outstanding hot mechanical strength and a low pores size that confers a low permeability to gas as well as a superior infiltration resistance to molten metal and slag and a low wettability.
Typical Technical Data
|
SiC |
min. (%) |
75 |
|
Si3N4 |
min. (%) |
23 |
|
Free-Si |
max. (%) |
0.10 |
|
Bulk Density |
g/cm3 |
2.7-2.8 |
|
Apparent Porosity |
% |
12-15 |
|
Compressive Strength (20oC) |
MPa |
580 |
|
Flexural Strength (20oC) |
MPa |
180-190 |
|
Flexural Strength (1350oC) |
MPa |
210 |
|
Thermal Expansion(1200oC) |
x10-6/oC |
4.70 |
|
Thermal Conductivity (1200oC) |
W/(m·K) |
19.6 |
|
Working Temperature |
max. (oC) |
1500 |
Note: Other chemical compositions are also available on request.